RAYPCB Expands Rogers High-Frequency PCB Production Capacity to Support Growing Global RF and 5G Demand Ready to Announce with Confidence?
Shenzhen, China--(Newsfile Corp. - January 21, 2026) - RAYPCB, a Shenzhen-based printed circuit board (PCB) manufacturer specializing in high-frequency and high-reliability applications, today announced an expansion of its Rogers material PCB manufacturing capacity to meet increasing global demand from RF-driven industries, including telecommunications, aerospace, automotive electronics, and satellite communications.
The expansion includes increased production throughput for Rogers laminate-based builds, enhanced process controls for impedance-sensitive applications, and additional support for both quick-turn prototyping and scaled production programs.
"High-frequency engineering is unforgiving-small inconsistencies can affect signal integrity, performance, and reliability," said judy a director at RAYPCB. "This capacity expansion strengthens our ability to deliver Rogers-based PCBs with stable quality and repeatable high-frequency performance for customers building next-generation RF products."
Capacity Expansion Targets Rogers High-Frequency Laminates for RF Applications
As global electronics continue shifting toward higher-frequency design requirements, manufacturers are increasingly adopting Rogers materials to improve electrical performance compared to standard FR-4 boards.
RAYPCB's expanded capability supports manufacturing on widely used Rogers laminate families, including:
The company stated that Rogers-based PCB manufacturing requires specialized drilling processes, controlled lamination methods, and tighter tolerances than conventional fabrication-areas that were central to the expansion initiative.
Supporting Advanced RF Engineering in Critical Industries
RAYPCB reported increasing customer demand for high-frequency PCBs supporting applications where signal integrity and thermal stability are essential, including:
The company's Rogers PCB production is designed for projects where impedance consistency, low-loss signal transmission, and reliability are key performance requirements.
Expanded Engineering Support and Testing for RF Performance Validation
Alongside manufacturing scale-up, RAYPCB also strengthened its engineering support workflow to help customers reduce iteration cycles and accelerate qualification timelines.
Key support areas include:
The company emphasized that these processes are intended to support consistent outcomes from prototype through volume production.
Faster Prototyping Options for Time-Sensitive RF Product Development
RAYPCB also highlighted its ongoing quick-turn prototyping capability for high-frequency Rogers builds, supporting engineering teams that need rapid validation cycles during product development. The company stated that certain prototype programs can be delivered on accelerated lead times depending on design complexity and material availability.
About RAYPCB
RAYPCB is a PCB manufacturer based in Shenzhen, China, specializing in high-frequency, high-reliability, and advanced PCB fabrication. The company provides services from prototyping through volume manufacturing for customers in telecommunications, aerospace, automotive electronics, and industrial markets.
Media Contact
RAYPCB
Judy
Email: sales@raypcb.com
Website: ** https://www.raypcb.com/**
To view the source version of this press release, please visit https://www.newsfilecorp.com/release/280922
Source: FG Newswire
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