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Form 8-K

sec.gov

8-K — Fabric.AI, Inc.

Accession: 0001493152-26-035850

Filed: 2026-08-03

Period: 2026-08-03

CIK: 0001086745

SIC: 4899 (COMMUNICATION SERVICES, NEC)

Item: Regulation FD Disclosure

Item: Financial Statements and Exhibits

Documents

8-K — form8-k.htm (Primary)

EX-99.1 (ex99-1.htm)

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UNITED

STATES

SECURITIES

AND EXCHANGE COMMISSION

Washington,

D.C. 20549

FORM

8-K

CURRENT

REPORT

PURSUANT

TO SECTION 13 OR 15(d) OF THE

SECURITIES

EXCHANGE ACT OF 1934

Date

of Report

(Date

of earliest event reported):

August

3, 2026

Fabric.AI,

Inc.

(Exact

name of registrant as specified in its charter)

Delaware

001-34643

98-0204758

(State

or other jurisdiction of

(Commission

(IRS

Employer

incorporation)

File

No.)

Identification

No.)

1185

Avenue of the Americas

New

York, NY 10036

(Address

of principal executive offices and zip code)

512-994-4917

(Registrant’s

telephone number, including area code)

N/A

(Former

name or former address, if changed since last report)

Check

the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under

any of the following provisions:

Written

communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)

Soliciting

material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)

Pre-commencement

communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))

Pre-commencement

communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))

Securities

registered pursuant to Section 12(b) of the Act:

Title

of each class

Trading

Symbol(s)

Name

of each exchange on which registered

Common

stock, par value $0.0001 per share

FABC

The

Nasdaq Stock Market LLC

Indicate

by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405

of this chapter) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2 of this chapter).

Emerging

growth company ☐

If

an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying

with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. ☐

Item

7.01

Regulation FD Disclosure.

On

August 3, 2026, Fabric.AI, Inc. issued a press release announcing the publication of a jointly authored white paper with Kopin Corporation

titled “Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure,” examining data movement as a

primary constraint on AI infrastructure and how MicroLED optical interconnects address it. A copy of the press release is furnished as

Exhibit 99.1 hereto.

The

information contained in this Item 7.01 of this Current Report on Form 8-K, including Exhibit 99.1 hereto, is being furnished and shall

not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange

Act”), or otherwise subject to the liabilities of that section, nor shall it be deemed incorporated by reference in any filing

under the Securities Act of 1933, as amended, or the Exchange Act, except as expressly set forth by specific reference in such filing.

Item

9.01

Financial

Statements and Exhibits.

(d)

Exhibits.

Exhibit

Number

Description

99.1

Press Release, dated August 3, 2026.

104

Cover

Page Interactive Data File (embedded within the Inline XBRL document)

SIGNATURES

Pursuant

to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by

the undersigned hereunto duly authorized.

Date:

August 3, 2026

FABRIC.AI,

INC.

By:

/s/

Joshua Silverman

Name:

Joshua

Silverman

Title:

Chief

Executive Officer

EX-99.1

EX-99.1

Filename: ex99-1.htm · Sequence: 2

Exhibit

99.1

Fabric.AI

and Kopin Publish Joint White Paper on MicroLED Optical Interconnect Technology for Next-Generation AI Data Centers

Massively

parallel architecture enables sub-picojoule-per-bit efficiency — a fraction of the energy consumed by conventional interconnects,

with direct implications for data center power and cooling costs

The

paper details how MicroLED optical links offer a roadmap to 20 Tb/s — scaling by channel count rather than lane speed as copper

and laser-based optics approach physical limits

NEW

YORK — August 3, 2026 — Fabric.AI, Inc. (Nasdaq: FABC), a fabless semiconductor company, and Kopin Corporation (Nasdaq:

KOPN), a leading developer of microdisplay and MicroLED technology — joint developers of the Neural I/o™ MicroLED-based optical

interconnect technology — today announced the publication of a jointly authored white paper, “Optical Interconnects as

a Critical Enabler for Next-Generation AI Infrastructure,” examining why data movement — not compute — has become

the primary constraint on AI infrastructure, and how MicroLED optical interconnects address it.

The

publication follows the companies’ ongoing collaboration to commercialize Neural I/o™, a MicroLED-based optical interconnect

platform designed to address the growing bandwidth and energy demands of next-generation AI infrastructure. The white paper outlines

the technical and architectural principles underpinning that platform and explains why MicroLED-based optical interconnects may offer

a more scalable and energy-efficient alternative as conventional interconnect technologies approach their physical limits.

The

white paper is available here.

AI

clusters now link tens of thousands of accelerators, and cluster performance is increasingly set by the interconnect rather than the

processor. The white paper presents an architectural comparison of copper, laser-based optical, and MicroLED optical interconnects, and

details how the MicroLED approach — moving data over hundreds to thousands of simple, low-power parallel channels instead of a

few high-speed serial lanes — enables sub-picojoule-per-bit efficiency while scaling aggregate link bandwidth toward 20 Tb/s and

beyond on published industry roadmaps.

Key

topics covered in the white paper include:

● Why

electrical interconnects face hard physical limits in bandwidth, power, reach, and heat as

AI clusters scale

● How

MicroLED’s massively parallel architecture achieves per-bit energy consumption a fraction

of the energy required by conventional interconnects — with direct implications for

data center power, cooling, and capital costs

● How

MicroLED arrays scale bandwidth by adding emitters within the same physical footprint —

without redesigning data center cabling, connectors, or topology

● A

roadmap analysis showing how channel count and per-channel speed compound toward 20+ Tb/s

links

“The

industry has spent decades making individual lanes faster, and that era is ending,” said Michael Murray, Kopin Chief Executive

Officer. “MicroLED technology changes the axis of scaling entirely. Kopin has spent years advancing the performance and manufacturability

of MicroLED technology, and this paper lays out clearly why that foundation matters for the largest infrastructure buildout in computing

history.”

“Every

conversation about AI infrastructure eventually arrives at the same bottleneck: moving data between chips,” said Josh Silverman,

Fabric.AI Chief Executive Officer. “We wrote this paper with Kopin to give investors, operators, and engineers a clear, honest

framework for understanding why interconnects have become AI’s primary bottleneck — and why an architecture built on parallelism

rather than lane speed is the path through that bottleneck. It reflects the thesis behind Neural I/o™, the platform we are developing

together.”

About

Fabric.AI, Inc.

Fabric.AI

(Nasdaq: FBIC) is developing next-generation AI infrastructure technologies designed to overcome the bandwidth, latency, and power limitations

of conventional computing architectures. The Company’s proprietary Neural I/o™ platform leverages MicroLED-based optical

interconnect technology to enable ultra-high-speed, energy-efficient communication between AI accelerators, processors, memory, and networking

systems, supporting the growing demands of large-scale AI training and inference.

Through

strategic collaborations with industry leaders and a focus on scalable, high-performance connectivity solutions, Fabric.AI is advancing

technologies that have the potential to improve the efficiency, performance, and economics of next-generation AI data centers and high-performance

computing environments.

For

more information, visit Fabric.AI.

About

Kopin Corporation

Kopin

Corporation (Nasdaq: KOPN) is a leading developer and provider of innovative display, Optical Interconnect devices and application-specific

optical solutions sold as critical components and subassemblies for defense, enterprise, professional and consumer products. Kopin’s

portfolio includes microdisplays, display modules, eyepiece assemblies, image projection modules and vehicle mounted and head-mounted

display systems that incorporate ultra-small high-resolution Active Matrix Liquid Crystal displays (AMLCD), Ferroelectric Liquid Crystal

on Silicon (FLCoS) displays, MicroLED displays (µLED) and Organic Light Emitting Diode (OLED) displays, a variety of optics and

low-power ASICs and optical interconnect devices for data centers.

For

more information, please visit Kopin’s website at www.kopin.com.

Kopin

is a trademark of Kopin Corporation.

Forward-Looking

Statements

This

press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including

statements regarding technology roadmaps, projected bandwidth and efficiency capabilities, market growth, and product development timelines.

Performance figures referenced in the white paper reflect published third-party industry demonstrations and roadmaps for the MicroLED

interconnect category and do not represent measured results of any Fabric.AI or Kopin product. Actual results may differ materially due

to risks and uncertainties described in each company’s filings with the Securities and Exchange Commission, including Fabric.AI’s

/ Kopin’s most recent annual and quarterly reports. Neither company undertakes any obligation to update forward-looking statements

except as required by law.

IR

Contact:

CORE

IR

212-644-0924

ir@fabric-ai.co

Media

Contact:

Fabric.AI

press@fabric-ai.co

www.fabricai.com

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