Form 8-K
8-K — Fabric.AI, Inc.
Accession: 0001493152-26-035850
Filed: 2026-08-03
Period: 2026-08-03
CIK: 0001086745
SIC: 4899 (COMMUNICATION SERVICES, NEC)
Item: Regulation FD Disclosure
Item: Financial Statements and Exhibits
Documents
8-K — form8-k.htm (Primary)
EX-99.1 (ex99-1.htm)
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UNITED
STATES
SECURITIES
AND EXCHANGE COMMISSION
Washington,
D.C. 20549
FORM
8-K
CURRENT
REPORT
PURSUANT
TO SECTION 13 OR 15(d) OF THE
SECURITIES
EXCHANGE ACT OF 1934
Date
of Report
(Date
of earliest event reported):
August
3, 2026
Fabric.AI,
Inc.
(Exact
name of registrant as specified in its charter)
Delaware
001-34643
98-0204758
(State
or other jurisdiction of
(Commission
(IRS
Employer
incorporation)
File
No.)
Identification
No.)
1185
Avenue of the Americas
New
York, NY 10036
(Address
of principal executive offices and zip code)
512-994-4917
(Registrant’s
telephone number, including area code)
N/A
(Former
name or former address, if changed since last report)
Check
the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under
any of the following provisions:
☐
Written
communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)
☐
Soliciting
material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)
☐
Pre-commencement
communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))
☐
Pre-commencement
communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))
Securities
registered pursuant to Section 12(b) of the Act:
Title
of each class
Trading
Symbol(s)
Name
of each exchange on which registered
Common
stock, par value $0.0001 per share
FABC
The
Nasdaq Stock Market LLC
Indicate
by check mark whether the registrant is an emerging growth company as defined in Rule 405 of the Securities Act of 1933 (§230.405
of this chapter) or Rule 12b-2 of the Securities Exchange Act of 1934 (§240.12b-2 of this chapter).
Emerging
growth company ☐
If
an emerging growth company, indicate by check mark if the registrant has elected not to use the extended transition period for complying
with any new or revised financial accounting standards provided pursuant to Section 13(a) of the Exchange Act. ☐
Item
7.01
Regulation FD Disclosure.
On
August 3, 2026, Fabric.AI, Inc. issued a press release announcing the publication of a jointly authored white paper with Kopin Corporation
titled “Optical Interconnects as a Critical Enabler for Next-Generation AI Infrastructure,” examining data movement as a
primary constraint on AI infrastructure and how MicroLED optical interconnects address it. A copy of the press release is furnished as
Exhibit 99.1 hereto.
The
information contained in this Item 7.01 of this Current Report on Form 8-K, including Exhibit 99.1 hereto, is being furnished and shall
not be deemed “filed” for purposes of Section 18 of the Securities Exchange Act of 1934, as amended (the “Exchange
Act”), or otherwise subject to the liabilities of that section, nor shall it be deemed incorporated by reference in any filing
under the Securities Act of 1933, as amended, or the Exchange Act, except as expressly set forth by specific reference in such filing.
Item
9.01
Financial
Statements and Exhibits.
(d)
Exhibits.
Exhibit
Number
Description
99.1
Press Release, dated August 3, 2026.
104
Cover
Page Interactive Data File (embedded within the Inline XBRL document)
SIGNATURES
Pursuant
to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by
the undersigned hereunto duly authorized.
Date:
August 3, 2026
FABRIC.AI,
INC.
By:
/s/
Joshua Silverman
Name:
Joshua
Silverman
Title:
Chief
Executive Officer
EX-99.1
EX-99.1
Filename: ex99-1.htm · Sequence: 2
Exhibit
99.1
Fabric.AI
and Kopin Publish Joint White Paper on MicroLED Optical Interconnect Technology for Next-Generation AI Data Centers
Massively
parallel architecture enables sub-picojoule-per-bit efficiency — a fraction of the energy consumed by conventional interconnects,
with direct implications for data center power and cooling costs
The
paper details how MicroLED optical links offer a roadmap to 20 Tb/s — scaling by channel count rather than lane speed as copper
and laser-based optics approach physical limits
NEW
YORK — August 3, 2026 — Fabric.AI, Inc. (Nasdaq: FABC), a fabless semiconductor company, and Kopin Corporation (Nasdaq:
KOPN), a leading developer of microdisplay and MicroLED technology — joint developers of the Neural I/o™ MicroLED-based optical
interconnect technology — today announced the publication of a jointly authored white paper, “Optical Interconnects as
a Critical Enabler for Next-Generation AI Infrastructure,” examining why data movement — not compute — has become
the primary constraint on AI infrastructure, and how MicroLED optical interconnects address it.
The
publication follows the companies’ ongoing collaboration to commercialize Neural I/o™, a MicroLED-based optical interconnect
platform designed to address the growing bandwidth and energy demands of next-generation AI infrastructure. The white paper outlines
the technical and architectural principles underpinning that platform and explains why MicroLED-based optical interconnects may offer
a more scalable and energy-efficient alternative as conventional interconnect technologies approach their physical limits.
The
white paper is available here.
AI
clusters now link tens of thousands of accelerators, and cluster performance is increasingly set by the interconnect rather than the
processor. The white paper presents an architectural comparison of copper, laser-based optical, and MicroLED optical interconnects, and
details how the MicroLED approach — moving data over hundreds to thousands of simple, low-power parallel channels instead of a
few high-speed serial lanes — enables sub-picojoule-per-bit efficiency while scaling aggregate link bandwidth toward 20 Tb/s and
beyond on published industry roadmaps.
Key
topics covered in the white paper include:
● Why
electrical interconnects face hard physical limits in bandwidth, power, reach, and heat as
AI clusters scale
● How
MicroLED’s massively parallel architecture achieves per-bit energy consumption a fraction
of the energy required by conventional interconnects — with direct implications for
data center power, cooling, and capital costs
● How
MicroLED arrays scale bandwidth by adding emitters within the same physical footprint —
without redesigning data center cabling, connectors, or topology
● A
roadmap analysis showing how channel count and per-channel speed compound toward 20+ Tb/s
links
“The
industry has spent decades making individual lanes faster, and that era is ending,” said Michael Murray, Kopin Chief Executive
Officer. “MicroLED technology changes the axis of scaling entirely. Kopin has spent years advancing the performance and manufacturability
of MicroLED technology, and this paper lays out clearly why that foundation matters for the largest infrastructure buildout in computing
history.”
“Every
conversation about AI infrastructure eventually arrives at the same bottleneck: moving data between chips,” said Josh Silverman,
Fabric.AI Chief Executive Officer. “We wrote this paper with Kopin to give investors, operators, and engineers a clear, honest
framework for understanding why interconnects have become AI’s primary bottleneck — and why an architecture built on parallelism
rather than lane speed is the path through that bottleneck. It reflects the thesis behind Neural I/o™, the platform we are developing
together.”
About
Fabric.AI, Inc.
Fabric.AI
(Nasdaq: FBIC) is developing next-generation AI infrastructure technologies designed to overcome the bandwidth, latency, and power limitations
of conventional computing architectures. The Company’s proprietary Neural I/o™ platform leverages MicroLED-based optical
interconnect technology to enable ultra-high-speed, energy-efficient communication between AI accelerators, processors, memory, and networking
systems, supporting the growing demands of large-scale AI training and inference.
Through
strategic collaborations with industry leaders and a focus on scalable, high-performance connectivity solutions, Fabric.AI is advancing
technologies that have the potential to improve the efficiency, performance, and economics of next-generation AI data centers and high-performance
computing environments.
For
more information, visit Fabric.AI.
About
Kopin Corporation
Kopin
Corporation (Nasdaq: KOPN) is a leading developer and provider of innovative display, Optical Interconnect devices and application-specific
optical solutions sold as critical components and subassemblies for defense, enterprise, professional and consumer products. Kopin’s
portfolio includes microdisplays, display modules, eyepiece assemblies, image projection modules and vehicle mounted and head-mounted
display systems that incorporate ultra-small high-resolution Active Matrix Liquid Crystal displays (AMLCD), Ferroelectric Liquid Crystal
on Silicon (FLCoS) displays, MicroLED displays (µLED) and Organic Light Emitting Diode (OLED) displays, a variety of optics and
low-power ASICs and optical interconnect devices for data centers.
For
more information, please visit Kopin’s website at www.kopin.com.
Kopin
is a trademark of Kopin Corporation.
Forward-Looking
Statements
This
press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995, including
statements regarding technology roadmaps, projected bandwidth and efficiency capabilities, market growth, and product development timelines.
Performance figures referenced in the white paper reflect published third-party industry demonstrations and roadmaps for the MicroLED
interconnect category and do not represent measured results of any Fabric.AI or Kopin product. Actual results may differ materially due
to risks and uncertainties described in each company’s filings with the Securities and Exchange Commission, including Fabric.AI’s
/ Kopin’s most recent annual and quarterly reports. Neither company undertakes any obligation to update forward-looking statements
except as required by law.
IR
Contact:
CORE
IR
212-644-0924
ir@fabric-ai.co
Media
Contact:
Fabric.AI
press@fabric-ai.co
www.fabricai.com
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