GPU Heatsink and Thermal Module - Market Size, Share, Trends, and Forecasts 2026-2031 | AI Data Centers and Liquid Cooling Drive 16.37% CAGR to USD 7.34 Billion
Dublin, Oct. 26, 2026 (GLOBE NEWSWIRE) -- "GPU Heatsink And Thermal Module - Market Share Analysis, Industry Trends & Statistics, Growth Forecasts (2026-2031)" has been added to ResearchAndMarkets.com's offering.
GPU Heatsink and Thermal Module Market to Reach USD 7.34 Billion by 2031 as AI Infrastructure Expands
The global GPU heatsink and thermal module market is projected to increase from USD 3.1 billion in 2025 to USD 3.44 billion in 2026 before reaching USD 7.34 billion by 2031. The market is expected to grow at a CAGR of 16.37% during 2026-2031, supported by rising GPU power density, expanding artificial intelligence infrastructure, high-performance gaming, and the transition toward advanced liquid-cooling systems.
AI Workloads Accelerate Demand for Advanced GPU Cooling
Rapid investment in AI data centers is reshaping the GPU thermal management market. Hyperscale operators spent more than USD 300 billion on AI infrastructure in 2026, including liquid-cooling distribution units designed for racks exceeding 100 kilowatts. High-performance accelerators are generating unprecedented thermal loads: NVIDIA's H200 dissipates 700 watts, AMD's MI300X reaches 750 watts, and Intel's Gaudi 3 delivers 1200 watts under liquid cooling.
These power requirements are pushing conventional air-cooled designs beyond practical and economic limits. Delta Electronics reported that liquid-cooling penetration increased from 14% in 2024 to 40% in 2026, highlighting a significant market transition. Traditional finned heat sinks remain suitable for edge-inference systems below 300 watts, while vapor chambers, cold plates, and active thermal modules are becoming essential for GPUs operating at 500 watts and above.
Higher Thermal Design Power Drives Product Innovation
GPU power envelopes continue to rise with each process generation. NVIDIA's RTX 5090 approaches 600 watts during sustained ray tracing, while memory junction temperatures can reach 92 C despite triple-slot cooling solutions. The RTX 4090's 450-watt specification already encouraged board partners to adopt vapor chambers capable of distributing heat across larger fin surfaces.
Thermal-interface materials exceeding 15 W m-K are also gaining importance, although they require metal backplates to maintain consistent contact pressure. At the same time, IEC 62368-1 touch-temperature limits restrict fin density and encourage manufacturers to develop more efficient airflow systems, vapor-chamber structures, and cold-plate microchannels.
OEM Adoption of Integrated Liquid Cooling Reshapes Sales
Server manufacturers increasingly provide closed-loop liquid systems pre-installed, reducing demand for separate aftermarket cooling modules. Lenovo's Neptune platform achieves a 1.1 power-usage effectiveness and recycles waste heat for facility heating, reducing cooling energy consumption by 40%. Dell's PowerCool eRDHx supports 80-kilowatt racks that conventional air systems cannot cool without excessive noise and energy use.
Asetek's USD 35 million, two-year supply contract also reflects the shift toward OEM-centric revenue models. Integrated liquid loops are expanding the overall GPU thermal module market, although they are limiting sales of standalone heat sinks in data-center environments where liquid cooling is increasingly standard.
Vapor Chambers Lead Product Growth
Vapor chambers are expected to record the fastest product growth, with a projected CAGR of 17.17%, as GPU power requirements exceed 600 watts. Heat sinks accounted for 37.48% of market revenue in 2025 and continue to support sub-300-watt consumer GPUs. However, their market share is expected to decline as manufacturers adopt vapor chambers for high-end graphics cards and professional systems.
Heat-pipe modules remain relevant for RTX 4080-class cards operating near 320 watts, but capillary limits constrain their performance at higher power levels. Solder-attached vapor chambers can reduce GPU junction temperatures by 10-15%, making them valuable in professional rendering workstations. Active thermal modules integrating pumps and radiators enable rack densities above 100 kilowatts, while innovations such as TaiSol's 3D vapor chamber and Cooler Master's FreeForm 2.0 support chiplet layouts and dual-GPU cooling configurations.
Asia-Pacific Maintains Market Leadership
Asia-Pacific generated 67.81% of global revenue in 2025 and is forecast to grow at a CAGR of 17.29% through 2031. Taiwan's vapor-chamber manufacturing expertise and China's large-scale assembly capacity support the region's leadership. Delta Electronics has committed NTD 12.1 billion, equivalent to USD 380 million, to expand production capacity in Taoyuan. Japan's Furukawa Electric supplies sintered pipes for 1U chassis, while Vietnam and Thailand are emerging as cost-competitive assembly locations.
North America is the second-largest market, driven by hyperscale data center campuses in Virginia, Oregon, and Iowa. These facilities are adopting liquid-cooled racks exceeding 100 kilowatts, supported by tax incentives and renewable energy access. European demand is concentrated in German automotive simulation clusters and United Kingdom fintech data centers, where carbon-pricing regulations encourage energy-efficient cold plates and advanced cooling systems.
Brazil is transitioning toward 30-kilowatt data center racks requiring advanced vapor-chamber solutions, while Gulf nations are deploying liquid-cooled workstations for AI-driven oil exploration. Suppliers are also expanding production in Vietnam, Thailand, and Mexico to reduce dependence on Taiwan-centric manufacturing and strengthen global supply chain resilience.
Key Topics Covered:
1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET LANDSCAPE
4.1 Market Overview
4.2 Market Drivers
4.2.1 Surging AI Workloads Driving Data-Center GPU Shipments
4.2.2 Escalating Thermal Design Power of Advanced Nodes
4.2.3 Growth of Ray-Tracing Gaming Titles
4.2.4 Expansion of Cloud Gaming Infrastructure Globally
4.2.5 Emergence of Chiplet-Based GPU Architectures
4.2.6 Increasing Use of Solder-Attached Vapor Chambers in Workstations
4.3 Market Restraints
4.3.1 Volatility in Copper Commodity Prices
4.3.2 OEM Shift Toward Integrated Liquid Cooling Loops
4.3.3 Supply Chain Concentration in East Asia
4.3.4 Environmental Regulations on Mining of Thermal Interface Metals
4.4 Impact of Macroeconomic Factors on the Market
4.5 Industry Value Chain Analysis
4.6 Regulatory Landscape
4.7 Technological Outlook
4.8 Porter's Five Forces Analysis
4.8.1 Bargaining Power of Suppliers
4.8.2 Bargaining Power of Buyers
4.8.3 Threat of New Entrants
4.8.4 Threat of Substitutes
4.8.5 Intensity of Competitive Rivalry
5 MARKET SIZE AND GROWTH FORECASTS (VALUE)
5.1 By Product Type
5.1.1 Heat Sinks
5.1.2 Vapor Chambers
5.1.3 Heat Pipe-Based Modules
5.1.4 Active Thermal Modules
5.2 By Material
5.2.1 Aluminum-Based
5.2.2 Copper-Based
5.2.3 Hybrid (Aluminum + Copper)
5.3 By GPU Type
5.3.1 Data Center / AI GPUs
5.3.2 Workstation GPUs
5.3.3 Consumer / Gaming GPUs
5.4 By Geography
5.4.1 North America
5.4.1.1 United States
5.4.1.2 Canada
5.4.1.3 Mexico
5.4.2 Europe
5.4.2.1 United Kingdom
5.4.2.2 Germany
5.4.2.3 France
5.4.2.4 Italy
5.4.2.5 Rest of Europe
5.4.3 Asia-Pacific
5.4.3.1 China
5.4.3.2 Japan
5.4.3.3 India
5.4.3.4 South Korea
5.4.3.5 Southeast Asia
5.4.3.6 Rest of Asia-Pacific
5.4.4 South America
5.4.4.1 Brazil
5.4.4.2 Rest of South America
5.4.5 Middle East and Africa
6 COMPETITIVE LANDSCAPE
6.1 Market Concentration
6.2 Strategic Moves
6.3 Market Share Analysis
6.4 Company Profiles (includes Global Level Overview, Market Level Overview, Core Segments, Financials as available, Strategic Information, Market Rank/Share, Products and Services, Recent Developments)
6.4.1 Boyd Corporation
6.4.2 Cooler Master Technology Inc.
6.4.3 Noctua GmbH
6.4.4 Arctic GmbH
6.4.5 Hon Hai Precision Industry Co., Ltd.
6.4.6 Delta Electronics, Inc.
6.4.7 Sunonwealth Electric Machine Industry Co., Ltd.
6.4.8 Furukawa Electric Co., Ltd.
6.4.9 Asia Vital Components Co., Ltd.
6.4.10 Taisol Electronics Co., Ltd.
6.4.11 Asetek A/S
6.4.12 EKWB d.o.o.
6.4.13 Thermalright Inc.
6.4.14 Listan GmbH
6.4.15 Corsair Gaming, Inc.
6.4.16 ASUSTeK Computer Inc.
6.4.17 Gigabyte Technology Co., Ltd.
6.4.18 Micro-Star International Co., Ltd.
6.4.19 Zotac Technology Limited
6.4.20 Palit Microsystems Ltd.
7 MARKET OPPORTUNITIES AND FUTURE OUTLOOK
7.1 White-Space and Unmet-Need Assessment
For more information about this report visit https://www.researchandmarkets.com/r/ymd7ei
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